GAL16VP8B-25LJ vs PAL16L8A-2DMB feature comparison

GAL16VP8B-25LJ Lattice Semiconductor Corporation

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PAL16L8A-2DMB Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code QLCC
Package Description QCCJ, LDCC20,.4SQ DIP, DIP20,.3
Pin Count 20
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature REGISTER PRELOAD; POWER-UP RESET
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 40 MHz
JESD-30 Code S-PQCC-J20 R-XDIP-T20
JESD-609 Code e0 e0
Length 8.9662 mm
Moisture Sensitivity Level 1
Number of Dedicated Inputs 8
Number of I/O Lines 8
Number of Inputs 18 16
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8 DEDICATED INPUTS, 8 I/O
Output Function MACROCELL COMBINATORIAL
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code QCCJ DIP
Package Equivalence Code LDCC20,.4SQ DIP20,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 25 ns 40 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 8.9662 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Screening Level 38535Q/M;38534H;883B

Compare GAL16VP8B-25LJ with alternatives

Compare PAL16L8A-2DMB with alternatives