GAL22CV10-10LVC
vs
PAL16R8BML883B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MONOLITHIC MEMORIES
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Architecture |
PAL-TYPE
|
PAL-TYPE
|
Clock Frequency-Max |
71 MHz
|
30 MHz
|
JESD-30 Code |
S-PQCC-J28
|
S-XQCC-N20
|
JESD-609 Code |
e0
|
e0
|
Number of Inputs |
22
|
8
|
Number of Outputs |
10
|
8
|
Number of Product Terms |
132
|
64
|
Number of Terminals |
28
|
20
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Function |
MACROCELL
|
REGISTERED
|
Package Body Material |
PLASTIC
|
CERAMIC
|
Package Code |
QCCJ
|
QCCN
|
Package Equivalence Code |
LDCC28,.5SQ
|
LCC20,.35SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Programmable Logic Type |
EE PLD
|
OT PLD
|
Propagation Delay |
10 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
1
|
2
|
Package Description |
|
QCCN, LCC20,.35SQ
|
ECCN Code |
|
3A001.A.2.C
|
Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare GAL22CV10-10LVC with alternatives
Compare PAL16R8BML883B with alternatives