GAL22CV10-10LVC
vs
PAL20X8MJS883C
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MONOLITHIC MEMORIES
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
71 MHz
|
10.5 MHz
|
| JESD-30 Code |
S-PQCC-J28
|
R-XDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Number of Inputs |
22
|
12
|
| Number of Outputs |
10
|
10
|
| Number of Product Terms |
132
|
40
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Function |
MACROCELL
|
|
| Package Body Material |
PLASTIC
|
CERAMIC
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
DIP24,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Programmable Logic Type |
EE PLD
|
OT PLD
|
| Propagation Delay |
10 ns
|
55 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
DIP, DIP24,.3
|
| ECCN Code |
|
3A001.A.2.C
|
| Screening Level |
|
MIL-STD-883 Class C
|
|
|
|
Compare GAL22CV10-10LVC with alternatives
Compare PAL20X8MJS883C with alternatives