GAL22CV10-10LVC
vs
PAL20X8MJS883B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MONOLITHIC MEMORIES
|
Package Description |
QCCJ, LDCC28,.5SQ
|
DIP, DIP24,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Architecture |
PAL-TYPE
|
PAL-TYPE
|
Clock Frequency-Max |
71 MHz
|
10.5 MHz
|
JESD-30 Code |
S-PQCC-J28
|
R-XDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Number of Inputs |
22
|
12
|
Number of Outputs |
10
|
10
|
Number of Product Terms |
132
|
40
|
Number of Terminals |
28
|
24
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Function |
MACROCELL
|
|
Package Body Material |
PLASTIC
|
CERAMIC
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC28,.5SQ
|
DIP24,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Programmable Logic Type |
EE PLD
|
OT PLD
|
Propagation Delay |
10 ns
|
55 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A001.A.2.C
|
Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare GAL22CV10-10LVC with alternatives
Compare PAL20X8MJS883B with alternatives