GAL22V10D-25QPN vs PALCE22V10Q-25PC feature comparison

GAL22V10D-25QPN Lattice Semiconductor Corporation

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PALCE22V10Q-25PC Vantis Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP VANTIS CORP
Part Package Code DIP
Package Description DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 33.3 MHz 35.7 MHz
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e3 e0
Length 31.75 mm
Moisture Sensitivity Level 1
Number of Dedicated Inputs 11 12
Number of I/O Lines 10 10
Number of Inputs 22 22
Number of Outputs 10 10
Number of Product Terms 132 132
Number of Terminals 24 24
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 11 DEDICATED INPUTS, 10 I/O 12 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type EE PLD EE PLD
Propagation Delay 25 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.334 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 3

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