GD54HC00 vs TC74HC00AFN-ELP feature comparison

GD54HC00 Goldstar Electron Co Ltd

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TC74HC00AFN-ELP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD TOSHIBA CORP
Package Description , SOP,
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 27 ns 19 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
HTS Code 8542.39.00.01
JESD-609 Code e4
Length 8.65 mm
Seated Height-Max 1.75 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Width 3.9 mm

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Compare TC74HC00AFN-ELP with alternatives