GD54HC00D vs 74HC00DB,112 feature comparison

GD54HC00D Goldstar Electron Co Ltd

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74HC00DB,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD NXP SEMICONDUCTORS
Package Description , 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 27 ns 135 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SSOP1
Pin Count 14
Manufacturer Package Code SOT337-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
JESD-609 Code e4
Length 6.2 mm
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Code SSOP
Package Equivalence Code SSOP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Seated Height-Max 2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

Compare GD54HC00D with alternatives

Compare 74HC00DB,112 with alternatives