Findchips: Compare GD54HC00J vs 74HC03DB,112

GD54HC00J vs 74HC03DB,112 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	GOLDSTAR ELECTRON CO LTD	NXP SEMICONDUCTORS
Package Description	,	SOT-337-1, SSOP-14
Reach Compliance Code	unknown	compliant
Family	HC/UH	HC/UH
JESD-30 Code	R-CDIP-T14	R-PDSO-G14
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
Package Code	DIP	SSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)	27 ns	29 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Position	DUAL	DUAL
Base Number Matches	2	2
Rohs Code		Yes
Part Package Code		SSOP1
Pin Count		14
Manufacturer Package Code		SOT337-1
HTS Code		8542.39.00.01
JESD-609 Code		e4
Length		6.2 mm
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Output Characteristics		OPEN-DRAIN
Package Equivalence Code		SSOP14,.3
Packing Method		BULK
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		29 ns
Schmitt Trigger		NO
Seated Height-Max		2 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		0.65 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		5.3 mm
	Logic » Gates	Logic » Gates