GD54HC00J vs U74HC00-S14-T feature comparison

GD54HC00J LG Semicon Co Ltd

Buy Now Datasheet

U74HC00-S14-T Unisonic Technologies Co Ltd

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer LG SEMICON CO LTD UNISONIC TECHNOLOGIES CO LTD
Package Description DIP, DIP14,.3 SOP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.0052 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 27 ns 18 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Load Capacitance (CL) 50 pF
Number of Functions 4
Number of Inputs 2
Packing Method TUBE
Power Supply Current-Max (ICC) 0.002 mA
Propagation Delay (tpd) 90 ns
Seated Height-Max 1.75 mm
Width 3.9 mm

Compare U74HC00-S14-T with alternatives