GD54HC132J vs 74HC132D-Q100 feature comparison

GD54HC132J LG Semicon Co Ltd

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74HC132D-Q100 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LG SEMICON CO LTD NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 36 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 190 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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