GD54HC132J vs TC74HC132AFN-ELP feature comparison

GD54HC132J Goldstar Electron Co Ltd

Buy Now Datasheet

TC74HC132AFN-ELP Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD TOSHIBA CORP
Package Description , SOP, SOP14,.25
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 36 ns 28 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Part Package Code SOIC
Pin Count 14
HTS Code 8542.39.00.01
JESD-609 Code e0
Length 8.65 mm
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Packing Method TR
Prop. Delay@Nom-Sup 28 ns
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare GD54HC132J with alternatives

Compare TC74HC132AFN-ELP with alternatives