GD54HC590J vs TC74HC590AP(F) feature comparison

GD54HC590J LG Semicon Co Ltd

Buy Now Datasheet

TC74HC590AP(F) Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD TOSHIBA CORP
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
Family HC/UH HC/UH
JESD-30 Code R-XDIP-T16 R-PDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF 150 pF
Load/Preset Input NO YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Max Frequency@Nom-Sup 16000000 Hz 24000000 Hz
Max I(ol) 0.006 A 0.0078 A
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 230 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 1
Part Package Code DIP
Pin Count 16
Samacsys Manufacturer Toshiba
Length 19.25 mm
Power Supply Current-Max (ICC) 75 mA
Prop. Delay@Nom-Sup 46 ns
Seated Height-Max 4.45 mm
Width 7.62 mm
fmax-Min 35 MHz

Compare TC74HC590AP(F) with alternatives