GD54HCT00J vs CD54HCT00F3A feature comparison

GD54HCT00J LG Semicon Co Ltd

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CD54HCT00F3A Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-CDIP-T14
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5 V 5 V
Prop. Delay@Nom-Sup 29 ns 30 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 4
Source Content uid CD54HCT00F3A
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
ECCN Code EAR99
Family HCT
Length 19.56 mm
Number of Functions 4
Number of Inputs 2
Packing Method TUBE
Power Supply Current-Max (ICC) 0.04 mA
Propagation Delay (tpd) 30 ns
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7.62 mm

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