GD54HCT00J vs GD74HC132J feature comparison

GD54HCT00J LG Semicon Co Ltd

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GD74HC132J Goldstar Electron Co Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Package Description DIP, DIP14,.3 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-CDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5 V
Prop. Delay@Nom-Sup 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Family HC/UH
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 30 ns
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V

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