GD74HC00
vs
8403701CA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
LG SEMICON CO LTD
MOTOROLA INC
Package Description
DIP-14
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T14
S-CQCC-N20
JESD-609 Code
e0
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Terminals
14
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Prop. Delay@Nom-Sup
23 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
4
5
Family
HC/UH
Length
8.89 mm
Number of Functions
4
Number of Inputs
2
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
135 ns
Seated Height-Max
2.03 mm
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
8.89 mm
Compare GD74HC00 with alternatives
Compare 8403701CA with alternatives