GD74HC00 vs CD54HC00F3A feature comparison

GD74HC00 LG Semicon Co Ltd

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CD54HC00F3A Texas Instruments

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer LG SEMICON CO LTD TEXAS INSTRUMENTS INC
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-CDIP-T14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 23 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 3
Pbfree Code Yes
Part Package Code DIP
Package Description CERAMIC, DIP-14
Pin Count 14
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Family HC/UH
Length 19.56 mm
Load Capacitance (CL) 50 pF
Number of Functions 4
Number of Inputs 2
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Propagation Delay (tpd) 135 ns
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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