GD74HC00J vs 74HC00D,652 feature comparison

GD74HC00J LG Semicon Co Ltd

Buy Now Datasheet

74HC00D,652 NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LG SEMICON CO LTD NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 23 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code SOIC
Pin Count 14
Manufacturer Package Code SOT108-1
ECCN Code EAR99
Samacsys Manufacturer NXP
Family HC/UH
Length 8.65 mm
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 135 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare 74HC00D,652 with alternatives