GD74HC00J vs HD74HC00FP feature comparison

GD74HC00J Goldstar Electron Co Ltd

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HD74HC00FP Hitachi Ltd

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD HITACHI LTD
Package Description , SOP, SOP14,.3
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 23 ns 115 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
HTS Code 8542.39.00.01
Length 10.06 mm
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Seated Height-Max 2.2 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 5.5 mm

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