GD74HC00J vs MC74HC00AD feature comparison

GD74HC00J LG Semicon Co Ltd

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MC74HC00AD Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LG SEMICON CO LTD MOTOROLA INC
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 23 ns 22 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 5
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Load Capacitance (CL) 50 pF
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 22 ns
Seated Height-Max 1.75 mm
Width 3.9 mm

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