GD74HC132 vs 74HC132DB-T feature comparison

GD74HC132 LG Semicon Co Ltd

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74HC132DB-T NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 SSOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup 30 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code SSOP
Pin Count 14
Family HC/UH
Length 6.2 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 38 ns
Seated Height-Max 2 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm

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