GD74HC132 vs HD74HC132P-E feature comparison

GD74HC132 LG Semicon Co Ltd

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HD74HC132P-E Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD RENESAS ELECTRONICS CORP
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 30 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
Family HC/UH
Length 19.2 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 125 ns
Seated Height-Max 5.06 mm
Width 7.62 mm

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