GD74HC132 vs SN74HC132DBLE feature comparison

GD74HC132 LG Semicon Co Ltd

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SN74HC132DBLE Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 SSOP, SSOP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup 30 ns 31 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code No
Part Package Code SSOP
Pin Count 14
Family HC/UH
Length 6.2 mm
Number of Functions 4
Number of Inputs 2
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 156 ns
Seated Height-Max 2 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm

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