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GD74HC132J vs TC74HC132AP feature comparison

GD74HC132J LG Semicon Co Ltd

Buy Now Datasheet

TC74HC132AP Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD TOSHIBA CORP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
Base Number Matches 2 1
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDIP-T14
Length 19.25 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 28 ns
Propagation Delay (tpd) 140 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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