GD74HC251J vs MM74HC251N feature comparison

GD74HC251J LG Semicon Co Ltd

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MM74HC251N Rochester Electronics LLC

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Rohs Code No Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer LG SEMICON CO LTD ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP16,.3 0.300 INCH, PLASTIC, MS-001, DIP-16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-XDIP-T16 R-PDIP-T16
JESD-609 Code e0 e3
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.006 A
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 51 ns
Propagation Delay (tpd) 215 ns 256 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 4
Pbfree Code Yes
Part Package Code DIP
Pin Count 16
Length 19.305 mm
Seated Height-Max 5.08 mm
Width 7.62 mm

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