GD74HCT00 vs HD74HC132RPEL feature comparison

GD74HCT00 Goldstar Electron Co Ltd

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HD74HC132RPEL Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD RENESAS ELECTRONICS CORP
Package Description , SOP, SOP14,.25
Reach Compliance Code unknown compliant
Family HCT HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 24 ns 125 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 3
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
HTS Code 8542.39.00.01
Length 8.65 mm
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25 ns
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 3.95 mm

Compare GD74HCT00 with alternatives

Compare HD74HC132RPEL with alternatives