GD74HCT00D
vs
74HC00DB,112
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAGNACHIP SEMICONDUCTOR LTD
|
NEXPERIA
|
Package Description |
SOP,
|
SSOP-14
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HCT
|
HC/UH
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
Propagation Delay (tpd) |
24 ns
|
135 ns
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SSOP1
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
SOT337-1
|
Date Of Intro |
|
2017-02-01
|
Samacsys Manufacturer |
|
Nexperia
|
JESD-609 Code |
|
e4
|
Length |
|
6.2 mm
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
2 mm
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Pitch |
|
0.65 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
5.3 mm
|
|
|
|
Compare GD74HCT00D with alternatives
Compare 74HC00DB,112 with alternatives