GD74HCT00J vs 74HCT00N,652 feature comparison

GD74HCT00J Goldstar Electron Co Ltd

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74HCT00N,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD NXP SEMICONDUCTORS
Package Description , 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Reach Compliance Code unknown compliant
Family HCT HCT
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 24 ns 29 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Manufacturer Package Code SOT27-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e4
Length 19.025 mm
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 29 ns
Schmitt Trigger NO
Seated Height-Max 4.2 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare GD74HCT00J with alternatives

Compare 74HCT00N,652 with alternatives