GD74HCT00J vs CD74HC132M96G4 feature comparison

GD74HCT00J LG Semicon Co Ltd

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CD74HC132M96G4 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 24 ns 38 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 188 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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