GD74HCT368 vs CD74HCT368EX feature comparison

GD74HCT368 LG Semicon Co Ltd

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CD74HCT368EX Intersil Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD INTERSIL CORP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW ENABLE LOW
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.004 A
Number of Bits 6 6
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 26 ns 45 ns
Qualification Status Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 3