Findchips: Compare GD74HCT377J vs 74HCT377PW,118

GD74HCT377J vs 74HCT377PW,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	GOLDSTAR ELECTRON CO LTD	NEXPERIA
Package Description	,	TSSOP-20
Reach Compliance Code	unknown	compliant
Additional Feature	WITH HOLD MODE	WITH HOLD MODE
Family	HCT	HCT
JESD-30 Code	R-CDIP-T20	R-PDSO-G20
Load Capacitance (CL)	50 pF
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	8	8
Number of Functions	1	1
Number of Terminals	20	20
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Polarity	TRUE	TRUE
Package Body Material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
Package Code	DIP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	32 ns	48 ns
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Position	DUAL	DUAL
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
fmax-Min	22 MHz	18 MHz
Base Number Matches	1	1
Rohs Code		Yes
Part Package Code		TSSOP2
Pin Count		20
Manufacturer Package Code		SOT360-1
HTS Code		8542.39.00.01
Factory Lead Time		6 Weeks
Date Of Intro		1995-11-01
Samacsys Manufacturer		Nexperia
JESD-609 Code		e4
Length		6.5 mm
Moisture Sensitivity Level		1
Packing Method		TR, 13 INCH
Peak Reflow Temperature (Cel)		260
Seated Height-Max		1.1 mm
Terminal Finish		NICKEL PALLADIUM GOLD
Terminal Pitch		0.65 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		4.4 mm
	Logic » FF/Latches	Logic » FF/Latches