GD74HCT377J vs 933835860025 feature comparison

GD74HCT377J Goldstar Electron Co Ltd

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933835860025 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD NXP SEMICONDUCTORS
Package Description , DIE,
Reach Compliance Code unknown unknown
Additional Feature WITH HOLD MODE
Family HCT HCT
JESD-30 Code R-CDIP-T20 R-XUUC-N
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Propagation Delay (tpd) 32 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL UPPER
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 22 MHz 18 MHz
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DIE
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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