GD74HCT688 vs 74HCT688N,652 feature comparison

GD74HCT688 Goldstar Electron Co Ltd

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74HCT688N,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD NXP SEMICONDUCTORS
Package Description , PLASTIC, DIP-20
Reach Compliance Code unknown compliant
Additional Feature CASCADABLE CASCADABLE
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDIP-T20
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type IDENTITY COMPARATOR IDENTITY COMPARATOR
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 42 ns 51 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Rohs Code Yes
Part Package Code DIP
Pin Count 20
Manufacturer Package Code SOT146-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e4
Length 26.73 mm
Package Equivalence Code DIP20,.3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 4.2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

Compare GD74HCT688 with alternatives

Compare 74HCT688N,652 with alternatives