GD74HCU04J
vs
935293642115
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
LG SEMICON CO LTD
|
NEXPERIA
|
Package Description |
DIP, DIP14,.3
|
HVQCCN,
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XDIP-T14
|
R-PQCC-N14
|
JESD-609 Code |
e0
|
e4
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
INVERTER
|
INVERTER
|
Max I(ol) |
0.004 A
|
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
HVQCCN
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Prop. Delay@Nom-Sup |
19 ns
|
|
Qualification Status |
Not Qualified
|
|
Schmitt Trigger |
NO
|
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Base Number Matches |
2
|
2
|
Family |
|
HC/UH
|
Length |
|
3 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
6
|
Number of Inputs |
|
1
|
Packing Method |
|
TR, 7 INCH
|
Peak Reflow Temperature (Cel) |
|
260
|
Propagation Delay (tpd) |
|
105 ns
|
Seated Height-Max |
|
1 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
2.5 mm
|
|
|
|
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