GL324
vs
LM324N
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
GOLDSTAR ELECTRON CO LTD
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
DIP-14
|
DIP-14
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
0.5 µA
|
| Common-mode Reject Ratio-Min |
65 dB
|
|
| Common-mode Reject Ratio-Nom |
70 dB
|
100 dB
|
| Input Offset Voltage-Max |
9000 µV
|
9000 µV
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
3 mA
|
3 mA
|
| Supply Voltage Limit-Max |
32 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
30 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Min |
15000
|
15000
|
| Base Number Matches |
3
|
19
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.25 µA
|
| Frequency Compensation |
|
YES
|
| JESD-609 Code |
|
e0
|
| Length |
|
19.4 mm
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP14,.3
|
| Seated Height-Max |
|
4.31 mm
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare GL324 with alternatives
Compare LM324N with alternatives