GS4576C18GM-25 vs MT49H32M18FM-18 feature comparison

GS4576C18GM-25 GSI Technology

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MT49H32M18FM-18 Micron Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY MICRON TECHNOLOGY INC
Package Description LBGA, 11 X 18.50 MM, MICRO, BGA-144
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.B EAR99
HTS Code 8542.32.00 8542.32.00.32
Date Of Intro 2017-10-03
Samacsys Manufacturer GSI TECHNOLOGY
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 95 °C
Operating Temperature-Min
Organization 32MX18 32MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA VBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.25 mm 0.93 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11 mm 11 mm
Base Number Matches 4 6
Part Package Code BGA
Pin Count 144
Access Time-Max 0.12 ns
Clock Frequency-Max (fCLK) 533 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA144,12X18,40/32
Qualification Status Not Qualified
Self Refresh YES
Sequential Burst Length 2,4,8
Terminal Finish TIN LEAD SILVER

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