GS4576C18GM-33 vs GS4576C18GL-33I feature comparison

GS4576C18GM-33 GSI Technology

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GS4576C18GL-33I GSI Technology

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Package Description LBGA, TFBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B EAR99
HTS Code 8542.32.00 8542.32.00.32
Date Of Intro 2017-10-03
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32MX18 32MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Seated Height-Max 1.25 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 11 mm 11 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 144
Qualification Status Not Qualified
Self Refresh YES

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