GS4576S18GL-33I vs MT49H32M18FM-18 feature comparison

GS4576S18GL-33I GSI Technology

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MT49H32M18FM-18 Micron Technology Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer GSI TECHNOLOGY MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, 11 X 18.50 MM, MICRO, BGA-144
Pin Count 144 144
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e1 e0
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 95 °C
Operating Temperature-Min -40 °C
Organization 32MX18 32MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 0.93 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 2 6
Access Time-Max 0.12 ns
Clock Frequency-Max (fCLK) 533 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA144,12X18,40/32
Power Supplies 1.5/1.8,1.8,2.5 V
Sequential Burst Length 2,4,8

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Compare MT49H32M18FM-18 with alternatives