GS4576S18L-18 vs MT49H32M18CHT-33:A feature comparison

GS4576S18L-18 GSI Technology

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MT49H32M18CHT-33:A Micron Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer GSI TECHNOLOGY MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, LEAD FREE, FBGA-144
Pin Count 144 144
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 95 °C
Operating Temperature-Min
Organization 32MX18 32MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11 mm 11 mm
Base Number Matches 1 1
Access Time-Max 20 ns
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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Compare MT49H32M18CHT-33:A with alternatives