GS4881-IDA
vs
EL1883ISZ-T13
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
GENNUM CORP
|
INTERSIL CORP
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
DIP, DIP8,.3
|
SOP, SOP8,.25
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SYNC SEPARATOR IC
|
SYNC SEPARATOR IC
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
7 mA
|
3 mA
|
Supply Voltage-Max (Vsup) |
13.2 V
|
5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Length |
|
4.89 mm
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.68 mm
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
3.9 mm
|
|
|
|
Compare GS4881-IDA with alternatives
Compare EL1883ISZ-T13 with alternatives