H5TQ4G63EFR-RDC vs H5TC4G63CFR-G7R feature comparison

H5TQ4G63EFR-RDC SK Hynix Inc

Buy Now Datasheet

H5TC4G63CFR-G7R SK Hynix Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code End Of Life Obsolete
Package Description TFBGA, TFBGA, BGA96,9X16,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
YTEOL .42
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13 mm 13 mm
Memory Density 4294967296 bit 4294967296 bit
Memory IC Type DDR3 DRAM DRAM MODULE
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 85 °C
Operating Temperature-Min
Organization 256MX16 256MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.575 V 1.45 V
Supply Voltage-Min (Vsup) 1.425 V 1.283 V
Supply Voltage-Nom (Vsup) 1.5 V 1.35 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 7.5 mm 7.5 mm
Base Number Matches 1 1
Access Time-Max 0.3 ns
Clock Frequency-Max (fCLK) 533 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
Output Characteristics 3-STATE
Package Equivalence Code BGA96,9X16,32
Power Supplies 1.35 V
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 4,8
Standby Current-Max 0.01 A
Supply Current-Max 0.155 mA

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