HA11441
vs
TDA2595N
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP, DIP18,.3
|
| Pin Count |
18
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
HORIZ/VERT DEFLECTION IC
|
HORIZONTAL DEFLECTION IC
|
| JESD-30 Code |
R-PDIP-T18
|
R-PDIP-T18
|
| Length |
24.5 mm
|
|
| Number of Terminals |
18
|
18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
DIP18,.3
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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