HA9P4741-9
vs
SA5532N
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
SOP, SOP16,.4
|
DIP, DIP8,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.4 µA
|
|
| Bias Current-Max (IIB) @25C |
0.3 µA
|
0.8 µA
|
| Common-mode Reject Ratio-Min |
80 dB
|
|
| Common-mode Reject Ratio-Nom |
74 dB
|
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
8500 µV
|
5000 µV
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage Limit-Max |
-20 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.4
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Nom |
1.6 V/us
|
9 V/us
|
| Supply Current-Max |
7 mA
|
16 mA
|
| Supply Voltage Limit-Max |
20 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
3500
|
10000
|
| Voltage Gain-Min |
25000
|
10000
|
| Base Number Matches |
3
|
4
|
|
|
|