HCF40257BC1
vs
CD40257BFMSH
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
HARRIS SEMICONDUCTOR
|
Part Package Code |
QLCC
|
|
Package Description |
QCCJ, LDCC20,.4SQ
|
DIP, DIP16,.3
|
Pin Count |
20
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T16
|
JESD-609 Code |
e3
|
e0
|
Length |
8.965 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC20,.4SQ
|
DIP16,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Prop. Delay@Nom-Sup |
300 ns
|
513 ns
|
Propagation Delay (tpd) |
380 ns
|
513 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
8.965 mm
|
|
Base Number Matches |
1
|
2
|
Max I(ol) |
|
0.00035999999999999997 A
|
Screening Level |
|
38535V;38534K;883S
|
Total Dose |
|
1M Rad(Si) V
|
|
|
|
Compare HCF40257BC1 with alternatives
Compare CD40257BFMSH with alternatives