HCPL-0601-500
vs
HCPL-5631
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
HEWLETT PACKARD CO
|
| Package Description |
SOIC-8
|
HERMETIC SEALED, DIP-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
UL RECOGNIZED, OPEN COLLECTOR
|
OPEN COLLECTOR, TTL COMPATIBLE, HIGH RELIABILITY
|
| Configuration |
SINGLE
|
1SEC2
|
| Forward Current-Max |
0.02 A
|
0.02 A
|
| Isolation Voltage-Max |
3750 V
|
1500 V
|
| JESD-609 Code |
e0
|
e0
|
| Mounting Feature |
SURFACE MOUNT
|
THROUGH HOLE MOUNT
|
| Number of Elements |
1
|
2
|
| Number of Functions |
1
|
2
|
| On-State Current-Max |
0.05 A
|
0.025 A
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.085 W
|
0.04 W
|
| Response Time-Nom |
5e-8 ns
|
3.5e-8 ns
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
7 V
|
5.5 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
3A001.A.2.C
|
| Data Rate-Nom |
|
10 MBps
|
| Hysteresis Ratio-Nom |
|
0.0125
|
|
|
|
Compare HCPL-0601-500 with alternatives
Compare HCPL-5631 with alternatives