HCPL-316J
vs
HCPL-316J
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
AVAGO TECHNOLOGIES INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
OVER CURRENT; UNDER VOLTAGE
|
OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE; TRANSIENT
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SOURCE
|
SINK
|
| Output Peak Current Limit-Nom |
2.5 A
|
2.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Turn-off Time |
0.5 µs
|
0.5 µs
|
| Turn-on Time |
0.5 µs
|
0.5 µs
|
| Base Number Matches |
2
|
6
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
SOP,
|
| Pin Count |
|
16
|
| Samacsys Manufacturer |
|
Avago Technologies
|
| Length |
|
10.312 mm
|
| Moisture Sensitivity Level |
|
1
|
| Package Code |
|
SOP
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
3.632 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
7.5 mm
|
|
|
|
Compare HCPL-316J with alternatives
Compare HCPL-316J with alternatives