HCPL-5630#200
vs
PS9601
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
NEC COMPOUND SEMICONDUCTOR DEVICES LTD
|
| Package Description |
HERMETIC SEALED, DIP-8
|
PLASTIC, DIP-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8541.40.80.00
|
|
| Additional Feature |
OPEN COLLECTOR, TTL COMPATIBLE, HIGH RELIABILITY
|
UL APPROVED
|
| Configuration |
1SEC2
|
SINGLE
|
| Data Rate-Nom |
10 MBps
|
10 MBps
|
| Forward Current-Max |
0.02 A
|
0.03 A
|
| Hysteresis Ratio-Nom |
0.0125
|
|
| Isolation Voltage-Max |
1500 V
|
5000 V
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
|
| Number of Elements |
2
|
1
|
| Number of Functions |
2
|
|
| On-State Current-Max |
0.025 A
|
0.05 A
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.04 W
|
|
| Response Time-Nom |
3.5e-8 ns
|
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5.5 V
|
|
| Surface Mount |
NO
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Base Number Matches |
3
|
5
|
|
|
|
Compare HCPL-5630#200 with alternatives
Compare PS9601 with alternatives