HCPL-5631#200 vs HCPL-5631 feature comparison

HCPL-5631#200 Agilent Technologies Inc

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HCPL-5631 Hewlett Packard Co

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer AGILENT TECHNOLOGIES INC HEWLETT PACKARD CO
Package Description HERMETIC SEALED, CERAMIC, DIP-8 HERMETIC SEALED, DIP-8
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8541.40.80.00 8541.40.80.00
Additional Feature OPEN COLLECTOR, TTL COMPATIBLE, HIGH RELIABILITY OPEN COLLECTOR, TTL COMPATIBLE, HIGH RELIABILITY
Configuration 1SEC2 1SEC2
Data Rate-Nom 10 MBps 10 MBps
Forward Current-Max 0.02 A 0.02 A
Hysteresis Ratio-Nom 0.0125 0.0125
Isolation Voltage-Max 1500 V 1500 V
JESD-609 Code e0 e0
Mounting Feature THROUGH HOLE MOUNT THROUGH HOLE MOUNT
Number of Elements 2 2
Number of Functions 2 2
On-State Current-Max 0.025 A 0.025 A
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Optoelectronic Device Type LOGIC IC OUTPUT OPTOCOUPLER LOGIC IC OUTPUT OPTOCOUPLER
Power Dissipation-Max 0.04 W 0.04 W
Response Time-Nom 3.5e-8 ns 3.5e-8 ns
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5.5 V 5.5 V
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Base Number Matches 3 3

Compare HCPL-5631#200 with alternatives

Compare HCPL-5631 with alternatives