HCPL-7800#300E
vs
HCPL-7825
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
HEWLETT PACKARD CO
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
100 MHz
|
200 MHz
|
| Common Mode Voltage-Max |
2.8 V
|
3750 V
|
| Isolation Voltage-Min |
3750 V
|
3750 V
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
|
| Length |
9.8 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.455 mm
|
|
| Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Voltage Gain-Max |
8.24
|
8.56
|
| Voltage Gain-Min |
7.76
|
7.44
|
| Width |
6.35 mm
|
|
| Base Number Matches |
1
|
1
|
| Technology |
|
CMOS
|
|
|
|
Compare HCPL-7800#300E with alternatives
Compare HCPL-7825 with alternatives