HCPL-7850#200
vs
HCPL-7850
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
AGILENT TECHNOLOGIES INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, SMDIP8,.3
|
DIP, DIP8,.3
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
Bandwidth (3dB)-Nom |
100 MHz
|
100 MHz
|
Common Mode Voltage-Max |
2.8 V
|
2.8 V
|
JESD-30 Code |
R-CDIP-T8
|
R-CDIP-T8
|
JESD-609 Code |
e0
|
e0
|
Length |
9.655 mm
|
9.655 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
SMDIP8,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.32 mm
|
4.32 mm
|
Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HYBRID
|
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Gain-Max |
8.4
|
8.4
|
Voltage Gain-Min |
7.6
|
7.6
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
3
|
4
|
Supply Current-Max |
|
15.5 mA
|
|
|
|
Compare HCPL-7850#200 with alternatives
Compare HCPL-7850 with alternatives