HCPL-7850100
vs
5962-9755701HYC
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
BROADCOM INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOI,
|
DIP, SMDIP8,.3
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
100 MHz
|
0.1 MHz
|
| JESD-30 Code |
R-PDSO-B8
|
R-CDIP-T8
|
| Length |
9.655 mm
|
9.655 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOI
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.32 mm
|
4.32 mm
|
| Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Form |
BUTT
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Voltage Gain-Max |
8.4
|
8.4
|
| Voltage Gain-Min |
7.6
|
7.6
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
4
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Factory Lead Time |
|
16 Weeks
|
| Common Mode Voltage-Max |
|
2.8 V
|
| JESD-609 Code |
|
e4
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Equivalence Code |
|
SMDIP8,.3
|
| Screening Level |
|
MIL-PRF-38534 Class H
|
| Supply Current-Max |
|
15.5 mA
|
| Technology |
|
HYBRID
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare HCPL-7850100 with alternatives
Compare 5962-9755701HYC with alternatives